epoxy resin glue potting machine for electronic components glue encapsulation
Machine Description
Our advanced Epoxy Resin Glue Potting Machine is engineered to deliver precision, efficiency, and reliability in the encapsulation of electronic components. this state-of-the-art equipment ensures optimal protection of sensitive electronics against moisture, dust, thermal stress, and mechanical shock, extending product lifespan and enhancing performance in demanding environments.
Key Features & Benefits:
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High-Precision Dispensing: Equipped with a mature epoxy glue dispensing system, the machine ensures accurate resin mixing ratios (±1% tolerance) and consistent application, minimizing material waste and defects.
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Adaptive Automation: Fully automated potting processes reduce manual intervention, boosting production throughput by up to percentages. Compatible with multi-component epoxies, silicones, and polyurethanes.
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Temperature & Curing Control: Integrated heating/cooling modules maintain optimal resin viscosity, while adjustable curing settings (time/temperature) accommodate diverse material requirements.
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Versatile Compatibility: Supports potting for a wide range of components, including PCBs, sensors, connectors, and microchips, with customizable fixtures for components up to 300x300mm.
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User-Friendly Interface: An intuitive touchscreen HMI allows easy parameter adjustments, recipe storage, and real-time monitoring of pressure, flow rate, and curing status.
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Durable Construction: Robust stainless-steel frame and corrosion-resistant components ensure longevity in high-volume manufacturing environments.
Industry Applications:
Ideal for automotive electronics, LED lighting, power modules, IoT devices, aerospace systems, and industrial equipment requiring reliable moisture and vibration resistance.
Why Choose Us?
Backed by 10+ years of expertise in industrial automation, our potting machines comply with ISO 9001 and CE standards. We offer tailored solutions, on-site training, and 24/7 technical support to streamline your production and ensure zero downtime.
Upgrade your encapsulation process with a machine that combines precision engineering, operational efficiency, and long-term durability. Contact us today to request a customized demo or quote!
Machine Features
- Metering, proportion, mixing, Dispensing are realized via automatic operation;
- Two 304 stainless steel container to store A glue and B glue separately to make sure glue will not solidify in long term reservation;
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handhold-control glue volume, flexible to meet different product glue potting
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Touch screen operation plus handhold teaching programming case, easy to learn and operate;
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According to the feature of products and production capacity requirement, fixture and glue delivery head can be customized.
Technical Parameters
| Model | MG-315 |
| Working Range | 0～500mm/sec |
| Repeat Accuracy | ±0.02mm |
| Mixing Proportion | 100:100～100:10(1:1~10:1) |
| Metering Method | Precise Gear Pump or Screw Pump |
| Mixing Method | Static Mixing |
| Mixing Accuracy | ±1% |
| Glue Extrusion Accuracy | ±1% |
| Glue Container Capacity | 30L 304 Stainless Barrel |
| Glue Viscosity | Max≤20000CPS |
| Glue Additive Proportion | MAX≤100(Glue):100(Additive)(1:1) |
| Glue Additive Size | Max≤400tsp |
| Control Mode | PLC+Handhold Teaching Programming Case+Touch Screen |
| Programming | Teaching Programming |
| Program Capacity | At least 100 unit, 4000 points/unit |
| Transmission Method | Steeping Motor+Synchronous Belt+Linear Guide-way |
| Working Pressure | 0.5-0.8Mpa |
| Working Power | AC220V 50HZ/2000W(stirring,vacuuming, heating not included) |
| Working Temperature | 0-40℃ |
| Working Humidity | 20-90% no condensation |
| Dimension | 1500*950*1500mm |
| Weight | About 350KG |
| Optional Functions | Glue container stirring, pre-heating, vacuum degassing, self-cleaning |
Machine Details
